NDLI: Modeling cathode spots in vacuum arcs burning on multi-component contacts

Content Provider	IEEE Xplore Digital Library
Author	Benilov, M.S. Benilova, L.G. Cunha, M.D. Hartmann, W. Lawall, A. Wenzel, N.
Copyright Year	2012
Description	Author affiliation: Departamento de Física, CCCEE, Universidade da Madeira, 9000 Funchal, Portugal (Benilov, M.S.; Benilova, L.G.; Cunha, M.D.) \|\| Siemens AG, Infrastructure & Cities, Low and Medium Voltage Division, Rohrdamm 88, 13629 Berlin, Germany (Lawall, A.) \|\| Siemens AG, Corporate Technology, Günther-Scharowsky-Strasse 1, 91058 Erlangen, Germany (Hartmann, W.; Wenzel, N.)
Abstract	A self-consistent space-resolved numerical model of cathode spots in vacuum arcs is developed on the basis of the COMSOL Multiphysics software. The model is applied to cathode spots on copper-chromium (CuCr) contacts of vacuum interrupters. In the limiting case of large grains, the main effect of change in cathode material from Cu to Cr is the reduction of thermal conductivity of the cathode material, which causes a reduction of spot radius and spot current. Hence, the model indicates that spots with currents of the order of tens of amperes on Cu coexist with spots on Cr with currents between one and two amperes. The parameters of spots on small Cr grains of the order of 10 μm size are rather close to those of spots on pure Cu, whereas the parameters for spots on medium-size Cr grains of around 20 μm are quite different from those of spots on both pure Cu and pure Cr. The power flux is directed from the cathode into the plasma, i.e., it is the cathode that heats the plasma — and not the other way round. What maintains the spot is a substantial Joule heating inside the cathode bulk. About 70 percent of the heat is generated in the grain and 30 percent in the surrounding copper. One may hypothesize that such grains are highly unstable, leading to explosive-like behavior with a consequent additional loss of cathode material, and a severe limitation in spot lifetime.
Starting Page	317
Ending Page	320
File Size	675853
Page Count	4
File Format	PDF
ISBN	9781467312639
ISSN	10932941
e-ISBN	9781467312660
e-ISBN	9781467312653
DOI	10.1109/DEIV.2012.6412517
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-09-02
Publisher Place	Russia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cathodes Copper Chromium Plasma temperature Materials Heating
Content Type	Text
Resource Type	Article
Subject	Computer Networks and Communications Software

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Retrograde motion of cathode spots

Near-Cathode Plasma Layer on CuCr Contacts of Vacuum Arcs

The influence of the surface structure on the behavior of arc cathode spots in vacuum

Modeling Spots on Composite Copper–Chromium Contacts of Vacuum Arcs and their Stability

Spectroscopic investigations of the cathode region of the free-burning copper arc

A cathode spot vacuum arc with graphite cathode

Cathode potential drop at a transient cathode spot on a microprotrusion

Use of Droplet Spots Burning for Decreasing of Droplet Fraction in Vacuum Arc Plasma

Movement, heating and evaporation of droplets in near-cathode region of vacuum arc

Modeling cathode spots in vacuum arcs burning on multi-component contacts

Similar Documents

Retrograde motion of cathode spots

Near-Cathode Plasma Layer on CuCr Contacts of Vacuum Arcs

The influence of the surface structure on the behavior of arc cathode spots in vacuum

Modeling Spots on Composite Copper–Chromium Contacts of Vacuum Arcs and their Stability

Spectroscopic investigations of the cathode region of the free-burning copper arc

A cathode spot vacuum arc with graphite cathode

Cathode potential drop at a transient cathode spot on a microprotrusion

Use of Droplet Spots Burning for Decreasing of Droplet Fraction in Vacuum Arc Plasma

Movement, heating and evaporation of droplets in near-cathode region of vacuum arc

Modeling cathode spots in vacuum arcs burning on multi-component contacts