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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Rydell, E.E. |
| Copyright Year | 1994 |
| Description | Author affiliation: Modular Electron., Rockwell, IO, USA (Rydell, E.E.) |
| Abstract | This paper explores and explains the parameters associated with the different classes of interconnection communications required for the application of modular architectures and concepts in an avionics environment. Some of these classes require virtual connectivity. Other classes require several levels of latency and levels of priority to support the requirements. The required connectivity acknowledgments and information receipt confirmation acknowledgments necessity to support all of these classes, are discussed in detail. The abstract defends the necessity of keeping to a generic backplane architecture which will support various protocols, but is aimed in particular at a serial, fiber optic interconnection. Discussion includes advantages of this approach which allows ease of bridging to other avionics module/system racks, and interfacing through a gateway to the aircraft bus.< |
| Starting Page | 17 |
| Ending Page | 22 |
| File Size | 572388 |
| Page Count | 6 |
| File Format | |
| ISBN | 0780324250 |
| DOI | 10.1109/DASC.1994.369510 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1994-10-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Aerospace electronics Spine Backplanes Protocols Standardization Aerospace engineering Systems engineering and theory Manufacturing Aircraft propulsion Aircraft manufacture |
| Content Type | Text |
| Resource Type | Article |
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