NDLI: Impact of mid-bond testing in 3D stacked ICs

Content Provider	IEEE Xplore Digital Library
Author	Taouil, M. Hamdioui, S. Marinissen, E.J. Bhawmik, S.
Copyright Year	2013
Description	Author affiliation: 3D Integration Program, IMEC vzw, Leuven, Belgium (Marinissen, E.J.) \|\| Qualcomm, Bridgewater, NJ, USA (Bhawmik, S.) \|\| Fac. of EE, Math. & CS, Delft Univ. of Technol., Delft, Netherlands (Taouil, M.; Hamdioui, S.)
Abstract	In contrast to planar ICs, during the manufacturing of three-dimensional stacked ICs (3D-SICs) several tests such as pre-bond, mid-bond, post-bond and final tests can be applied. This in turn results into a huge number of test flows/strategies. Selecting appropriate and efficient test flow (for given design and manufacturing parameters such as stack size, die yield, stack yield, etc) is crucial for overall cost optimization. To evaluate the test flows, a case study is performed in which 3D-COSTAR is used to compare the overall cost of producing a 3D-SIC using variable fault coverage during the mid-bond tests. In addition, we investigate the impact of the logistics cost for various test flows. The impact of logistics costs depend on the outsourced processing steps during the manufacturing. Simulation results show, for our parameters, that by choosing an appropriate test flow the overall 3D-SIC cost for appropriate fault coverages can reduce the overall cost up to 20% for a 5-layered 3D-SIC with die yields of 90%.
Sponsorship	IEEE Comput. Soc.
Starting Page	178
Ending Page	183
File Size	253145
Page Count	6
File Format	PDF
ISSN	15505774
e-ISBN	9781479915859
DOI	10.1109/DFT.2013.6653603
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-10-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Logistics Stacking Testing Packaging Three-dimensional displays Manufacturing Companies test flows 3D integration cost modeling test cost
Content Type	Text
Resource Type	Article

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