NDLI: Reliability of commercial plastic encapsulated microelectronics at temperatures from 125/spl deg/C to 300/spl deg/C

Content Provider	IEEE Xplore Digital Library
Author	McCluskey, P. Mensah, K. O'Connor, C. Lilie, F. Gallo, A. Fink, J.
Copyright Year	2000
Description	Author affiliation: CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA (McCluskey, P.)
Abstract	Over 97% of all integrated circuits produced today are available only in plastic encapsulated, surface mountable, commercial grade or industrial grade versions. This is especially true for the most advanced technologies, such as high-speed microprocessors. The cost, availability, and functionality advantages of these devices are causing many electronics manufacturers to consider using them in elevated temperature applications such as avionics and automotive electronic systems to ensure early affordable access to leading edge technology. However, manufacturers only guarantee the operation of commercial devices in the 0 to 70/spl deg/C temperature range, and the industrial devices in the -40 to 85/spl deg/C temperature range. This paper describes the first study which addresses the reliability of plastic encapsulated microcircuits (PEMs) in the range from 125 to 300/spl deg/C, well outside the manufacturer's suggested temperature limits. In this study, Motorola MC68332 microcontroller, which is widely used in avionic systems, remained fully functional to 180/spl deg/C. However, this study also revealed that industrial grade, plastic encapsulated MC68332 devices had less than half the lifespan at 180/spl deg/C of similar MC68332 devices packaged in hermetic ceramic packages. In addition to the MC68332, the other nine types of plastic components studied had a shorter lifespan at 180/spl deg/C than their ceramic packaged counterparts. Outgassing of flame retardants with the associated catalysis of the growth of intermetallics was determined to be the principal cause of failure in the plastic components. Further studies conducted on 84-lead PQFP leadframes encapsulated in two different molding compounds revealed that the plastic encapsulant itself begins to lose its ability to insulate leads at temperatures greater than 250/spl deg/C and can actually combust at temperatures greater than 300/spl deg/C. Both insulation resistance degradation and cracking were found to be more prevalent in novalac than biphenyl.
Starting Page	445
Ending Page	450
File Size	588291
Page Count	6
File Format	PDF
ISBN	0780358465
ISSN	1095323X
DOI	10.1109/AERO.2000.878520
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-03-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectronics Manufacturing industries Temperature distribution Plastic packaging Plastics industry Aerospace electronics Ceramics Integrated circuit reliability Integrated circuit technology Microprocessors
Content Type	Text
Resource Type	Article
Subject	Aerospace Engineering Space and Planetary Science

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