NDLI: Effects of wafer emissivity on rapid thermal processing temperature measurement

Content Provider	IEEE Xplore Digital Library
Author	Chen, D.H. DeWitt, D.P. Tsai, B.K. Kreider, K.G. Kimes, W.A.
Copyright Year	2002
Description	Author affiliation: Opt. Technol. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA (Chen, D.H.; DeWitt, D.P.; Tsai, B.K.)
Abstract	Lightpipe radiation thermometers (LPRTs) are widely used to measure wafer temperatures in rapid thermal processing (RTP) tools. Using blackbody-calibrated LPRTs to infer the wafer temperature, it is necessary to build a model to predict the effective emissivity accounting for the wafer and chamber radiative properties as well as geometrical features of the chamber. The uncertainty associated with model-corrected temperatures can be investigated using test wafers instrumented with thin-film thermocouples (TFTCs) on which the LPRT target spot has been coated with films of different emissivity. A model of the wafer-chamber arrangement was used to investigate the effects of Pt (/spl epsiv//sub s/=0.25) and Au (/spl epsiv//sub s/=0.05) spots on the temperature distribution of the test wafers with the emissivity of 0.65 and 0.84. The effects of the shield reflectivity and the cool lightpipe (LP) tip on the wafer temperature were evaluated. A radiance analysis method was developed and a comparison of model-based predictions with experimental observations was made on a 200 mm wafer in the NIST RTP test bed. The temperature rises caused by the low-emissivity spot were predicted and the cooling effect of the LP tip was determined. The results of the study are important for developing the model-corrected temperature measurement and uncertainty estimates using LPRT in semiconductor thermal processes.
Starting Page	59
Ending Page	67
File Size	591242
Page Count	9
File Format	PDF
ISBN	0780374657
DOI	10.1109/RTP.2002.1039440
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-09-25
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Rapid thermal processing Temperature measurement Semiconductor device modeling Testing Predictive models Solid modeling Instruments Transistors Gold Temperature distribution
Content Type	Text
Resource Type	Article

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