NDLI: A transient thermal analysis using a simplified heat transfer coefficient model

Content Provider	IEEE Xplore Digital Library
Author	Asghari, T.A.
Copyright Year	2001
Description	Author affiliation: Integrated Electron. Syst. Sector, Automotive & Ind. Electron. Group, Northbrook, IL, USA (Asghari, T.A.)
Abstract	A transient thermal analysis was performed on the Motorola Automotive and Industrial Electronics Group (AIEG) electronic module to determine the maximum temperatures of a bare transistor die during cyclic electrical loading. The Icepak computational fluid dynamics (CFD) software was used to model system level transient thermal behaviour. An initial steady state full CFD model was solved for mass, momentum, and energy based on Navier-Stokes and energy equations using the finite volume method. Heat transfer coefficients were obtained from object surfaces in contact with the convective fluid and plotted as a linear function of wall temperature for various power dissipation levels. A model with a reduced meshed region of 1/6 of the full CFD model was developed. This model incorporates heat transfer coefficients, determined from full CFD steady state runs at various power dissipation levels, as boundary conditions on the walls of the computational domain coincident to the outer surfaces of the solid model and solves only for the energy equation. The heat transfer coefficient is input as a linear function of the wall temperature. The simplified heat transfer coefficient model can be accurately used to solve transient thermal analysis problems for various duty cycles. It reduces computation time by a factor of 10 relative to the full CFD model.
Sponsorship	Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	366
Ending Page	371
File Size	763737
Page Count	6
File Format	PDF
ISBN	0930815645
DOI	10.1109/ISAOM.2001.916603
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-03-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	International Microelectronicsand Packaging Society
Subject Keyword	Transient analysis Heat transfer Computational fluid dynamics Temperature Industrial electronics Steady-state Power dissipation Solid modeling Thermal loading Performance analysis
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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