NDLI: Improvements in adhesion using new Cu treatment method for substrates [packaging]

Content Provider	IEEE Xplore Digital Library
Author	Miller, J. Thompson, T.
Copyright Year	2001
Description	Author affiliation: Motorola Inc., Austin, TX, USA (Miller, J.)
Abstract	This report discusses the differences between the current jet scrub (mechanical) and newly used chemical etch processes in the substrate manufacturing process to etch copper. This newly proposed process is expected to increase package moisture performance by creating a rougher surface finish, resulting in interlocking of the solder mask to the copper. The differences between the two processes are covered in detail. The report discusses moisture results obtained, comparing the two processes with existing package materials in a BGA. The mold compound, nonconductive die attach and jet scrub substrate have achieved moisture sensitivity level 1 at 220/spl deg/C reflow in some cases of optimized substrate design. The process performance is benchmarked using four substrate suppliers used in the industry. Package moisture performance improvements are critical to passing higher reflow temperature requirements such as 240/spl deg/C and 260/spl deg/C for Pb-free solutions for environmentally sensitive products in the wireless and palm pilot communications market. Also included is a discussion of how the chemical etch performs based on other assembly quality measures such as wire ball shear, wire pull, solder ball adhesion and solder joint reliability. This new process is not expected to affect cost or cycle time and is seen as an improvement in overall product quality and reliability. However, due to varying experience with BGA moisture performance, especially in cases of large die to package ratios, it is hopeful that the process will provide more consistent results on the package.
Sponsorship	Int. Microelectron. & Packaging Soc. (IMAPS)
Starting Page	171
Ending Page	174
File Size	373845
Page Count	4
File Format	PDF
ISBN	0930815645
DOI	10.1109/ISAOM.2001.916570
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-03-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	International Microelectronicsand Packaging Society
Subject Keyword	Adhesives Packaging Moisture Copper Etching Wire Chemical processes Manufacturing processes Rough surfaces Surface roughness
Content Type	Text
Resource Type	Article

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