NDLI: Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials

Content Provider	IEEE Xplore Digital Library
Author	Shi, S.H. Yao, Q. Qu, J. Wong, C.P.
Copyright Year	2000
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Shi, S.H.)
Abstract	This paper investigates the correlation of thermo-mechanical reliability of no-flow flip-chip packages with the mechanical properties of the involved no-flow underfill materials. Fracture toughness (K/sub IC/) and fatigue property of the cured no-flow underfill materials are two possible factors that may be important in determining the collapse-controlled chip connection (C4) joint reliability. Seven no-flow underfill materials are formulated. Each should have at least one material property noticeably different from the others, so that a spectrum of any interested material property can be obtained. The interested material properties include heat distortion temperature (TMA Tg measured by thermomechanical analyzer), coefficient of thermal expansion (CTE), modulus, die shear strength, K/sub IC/, and fatigue. The measurement of K/sub IC/ is conducted using single edge notch bending (SENB) specimens. The specimens for fatigue testing are in dog-bone shape as described in ASTM D638M. The obtained S-N (Stress-Fatigue Life) curve is used as the measurement of the material fatigue property. The interested responses that we want to collect include the number of cycles under -55/spl deg/C to 125/spl deg/C air to air thermal cycling test and -55/spl deg/C to 125/spl deg/C liquid to liquid thermal shock test, and the failure mode of the C4 joint and cured underfill material.
Starting Page	271
Ending Page	277
File Size	584907
Page Count	7
File Format	PDF
ISBN	0930815599
DOI	10.1109/ISAPM.2000.869284
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-08-08
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Material properties Thermomechanical processes Materials reliability Joining materials Temperature measurement Distortion measurement Materials testing Packaging Mechanical factors
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in