NDLI: The Fidelity Property of the Elmore Delay Model in actual comparison of routing algorithms

Content Provider	IEEE Xplore Digital Library
Author	Santos, G. Reimann, T. Johann, M. Reis, R.
Copyright Year	2010
Description	Author affiliation: Programa de Pós Graduação em Microeletrônica - Instituto de Informática - UFRGS, Brazil (Santos, G.; Reimann, T.; Johann, M.; Reis, R.)
Abstract	Despite the existence of several other alternatives for estimating delay of interconnects, the Elmore Delay Model still has been used for comparison of routing algorithms. The criterion used to establish Elmore's model as a confident metric for this purpose is the so-called Fidelity Property. In this work we investigate the Fidelity Property using nowadays interconnect parameters, in four routing scopes. For the first time the Fidelity is evaluated in actual algorithms comparison, one of the main utilities it was established for. What is found is that the original methodology used to evaluate this property hides a significant standard deviation. This standard deviation strongly impacts the capacity of Elmore's model to provide good certainty of choosing the best routing solutions among several ones. Additionally, the experiments of algorithms comparison show that different routing alternatives are appropriated for different routing scopes, with respect to metal layers, driver strengths and routing areas.
Starting Page	195
Ending Page	202
File Size	2212446
Page Count	8
File Format	PDF
ISBN	9781424489367
ISSN	10636404
e-ISBN	9781424489374
DOI	10.1109/ICCD.2010.5647789
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-10-03
Publisher Place	Netherlands
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Routing Delay Metals Integrated circuit interconnections Driver circuits System-on-a-chip Capacitance
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Hardware and Architecture

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