NDLI: Area reduction on interconnect optimized floorplan using deadspace utilization

Content Provider	IEEE Xplore Digital Library
Author	Chiu-Wing Sham Young, E.F.Y.
Copyright Year	2004
Description	Author affiliation: Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China (Chiu-Wing Sham; Young, E.F.Y.)
Abstract	Interconnect optimization has become the major concern in floorplanning. Many approaches would use simulated annealing (SA) with a cost function composed of a weighted sum of area, wirelength and interconnect cost. These approaches can reduce the interconnect cost efficiently but the area penalty of the interconnect optimized floorplan is usually quite large. In this paper, we propose a new approach called deadspace utilization (DSU) to reclaim the unused area of an interconnect optimized floorplan by linear programming. Since modules are not necessarily rectangular in shape in floorplanning, some deadspace can be redistributed to the modules to increase the area occupied by the modules. If the area of each module can be expanded by the same ratio, the whole floorplan can be compacted by that ratio to give a smaller floorplan. In addition, we can limit the compaction ratio to prevent over-congestion. Experiments show that we can apply this deadspace utilization technique to reduce the area and wirelength of an interconnect optimized floorplan further while the constraint on routability and congestion can be maintained at the same time.
File Size	507306
File Format	PDF
ISBN	078038346X
DOI	10.1109/MWSCAS.2004.1354023
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-07-25
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Cost function Shape Constraint optimization Computer science Computational modeling Simulated annealing Linear programming Compaction Very large scale integration
Content Type	Text
Resource Type	Article

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