NDLI: 3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier

Content Provider	IEEE Xplore Digital Library
Author	Pfeffer, M. Goth, C. Craiovan, D. Franke, J.
Copyright Year	2011
Description	Author affiliation: Friedrich-Alexander-University Erlangen-Nuremberg, Institute for Manufacturing Automation and Production Systems (FAPS), Erlangen, Germany (Pfeffer, M.; Goth, C.; Craiovan, D.; Franke, J.)
Abstract	Three-dimensional circuit carriers offer an enormous potential to enhance the functionality and simultaneously miniaturize the overall size of electronic systems. These Molded Interconnect Devices (3D-MID) are manufactured by injection molding and structuring of 3D circuitry. But for the assembly of electronic components (like resistors, capacitors, IC etc.) on MID no standardized and cost-efficient production equipment is available. To overcome this challenge a method to extend the kinematics of SMD (surface mounted device) pick & place machines by automated multi axis workpiece carriers was developed. This manipulator is designed to realize the 3D-assembly of MID in SMD pick & place machines. By the extended kinematics, the placement of electronic components on inclined process areas of MID is enabled. The first result is a prototype, that approves the feasibility of the kinematic concept and the integration of the manipulator into pick & place machines. This article gives at first an overview of the MID technology with its manufacturing processes and innovative applications. The main requirements for assembling 3D-MID are discussed and the developed manipulator is presented. Finally two strategies for the integration of the manipulator into production lines and a comparison of different assembly solutions are described.
Starting Page	1
Ending Page	6
File Size	963577
Page Count	6
File Format	PDF
ISBN	9781612843421
e-ISBN	9781612843438
DOI	10.1109/ISAM.2011.5942362
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-05-25
Publisher Place	Finland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manipulators Assembly Substrates Production Three dimensional displays Magnetic heads Actuators pick & place machine Molded Interconnect Device MID SMD
Content Type	Text
Resource Type	Article

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