NDLI: Interconnection systems for solid-state components in hybrid integrated circuits

Content Provider	IEEE Xplore Digital Library
Author	Basseches, H.
Copyright Year	1963
Abstract	The factors which can influence the performance and reliability of the interconnection system for solid-state components in hybrid integrated circuits are examined. The main emphasis is on materials that have received most attention in the tantalum film and silicon technologies in the Bell System. However, other materials that are being used are discussed. The interrelation of various factors in choosing an interconnection system is discussed. These factors include the composition of the materials, the methods of depositing various metals, and the properties of the substrates. Among the properties of the materials that are considered, emphasis is laid on environmental stability. The results of environmental tests on conductors and thin-film resistors under high-humidity conditions are reported. Some results on the use of silicone rubber as an encapsulant indicate this material is effective in reducing degradative action on hybrid circuits.
Sponsorship	IEEE Publication
Starting Page	1468
Ending Page	1473
Page Count	6
File Size	1533021
File Format	PDF
ISSN	00189219
Volume Number	59
Issue Number	10
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1971-10-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Solid state circuits Hybrid integrated circuits Conducting materials Integrated circuit reliability Semiconductor films Silicon Integrated circuit technology Composite materials Inorganic materials
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

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