NDLI: Thin-film induced effects on the stability of SAW devices

Content Provider	IEEE Xplore Digital Library
Author	Sinha, B.K. Locke, S.
Copyright Year	1986
Abstract	Measurements show an upward shift on the order of 50 ppm in the resonant frequency of a surface acoustic wave (SAW) resonator, as taken before and after the device is hermetically sealed in vacuum following a certain glass-frit sealing process. The authors analyze some of the thin-film phenomena that are potential sources of the observed frequency shift and that may affect the long-term stability of such devices. Various factors contributing to the shifts include: 1) intrinsic or structural stresses in the bonding layers as well as in the interdigital transducer (IDT) fingers; 2) thermal stresses due to the differences in thermal expansion coefficients of the metallic IDT fingers and the bonding agent (glass frits) from those of quartz; 3) partial oxidation of the IDT fingers and transmission lines during the frit glazing process; and 4) possible metal diffusion into quartz. Quantitative estimates of the contribution of two factors to the total observed frequency shift after a certain glass-frit sealing process are provided. Rough estimates of the frequency shifts due to the oxidized film are made from the dispersion curves for a uniform thin aluminum film and for its oxide film as fully plated on a quartz substrate. It is concluded that the results may provide a way of estimating the magnitude of the intrinsic stress for a given long-term stability of the SAW device.<>
Page Count	11
File Size	1048227
Starting Page	231
Ending Page	241
File Format	PDF
ISSN	08853010
Volume Number	36
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-03-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thin film devices Stability Surface acoustic wave devices Thermal stresses Frequency estimation Fingers Diffusion bonding Thermal expansion Thermal factors Acoustic measurements
Content Type	Text
Resource Type	Article
Subject	Acoustics and Ultrasonics Instrumentation Electrical and Electronic Engineering

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