NDLI: Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Content Provider	IEEE Xplore Digital Library
Author	Hamasha, S. Qasaimeh, A. Jaradat, Y. Borgesen, P.
Copyright Year	2011
Abstract	The fatigue behavior of solder joints in realistic service applications is still not well understood. Service life prediction based on conducting accelerated tests and extrapolating test results therefore involves a high potential for error. Understanding both the evolution of solder joint properties and the damage accumulation has proved to be critical to reliability modeling. Damage accumulation in isothermal cycling is shown to scale with the accumulated inelastic work even in complex cycling scenarios, so that the life of a solder joint ends upon accumulation of a given amount of work. Individual ball grid array solder joints were cycled in shear fatigue experiments with different load amplitudes and strain rates. The effects of load amplitudes and strain rates on the work accumulation and fatigue life were systematically addressed. The correlation between different loading scenarios and the accumulated work to failure was also discussed. The results showed that the accumulated work until the development of a major crack is constant regardless of the load amplitude. After that the accumulated work to failure is lower for larger load amplitudes. For some reason, a larger fraction of the work appears to be dissipating as heat at lower load amplitude, but only during crack growth. On the other hand, the strain rate affects the fraction of the work going to heat even before the development of a major crack.
Starting Page	1292
Ending Page	1299
Page Count	8
File Size	1570359
File Format	PDF
ISSN	21563950
Volume Number	5
Issue Number	9
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Fatigue Strain Isothermal processes Stress Correlation Heating work accumulation. reliability solder work accumulation
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

Solder Joint Reliability of SnAgCu Solder Refinished Components Under Temperature Cycling Test

On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes

Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

Reliability of Lead-Free Solder Joints Under a Wide Range of Thermal Cycling Conditions

Effects of Bonding Pressures and Bonding Temperatures on Solder Joint Morphology and Reliability of Solder ACF Bonding

Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn–Ag–Cu Solder Interconnects

Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

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Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions

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