NDLI: Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

Content Provider	IEEE Xplore Digital Library
Author	Jiawei Zhang Thirugnanasambandam, S. Evans, J.L. Bozack, M.J. Sesek, R.
Copyright Year	2011
Abstract	A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105), Sn-3.0Ag-0.5Cu (SAC305), and Sn-37Pb solder ball interconnects. Package sizes ranging from 19 mm with 0.8-mm-pitch BGAs to 5 mm with 0.4-mm-pitch μ BGAs with three different board finishes (ImSn, ImAg, and SnPb) were evaluated. The aging temperatures were 25°C, 55°C, 85°C, and 125°C, applied for a period of 6 mo. Subsequently, the specimens were thermally cycled from -40°C to 125°C with 15-min dwell times at the high temperature. Weibull analysis of failures versus cycle number show a ~ 50% reduction in package lifetimes when aged at 125^°C compared to the same at room temperature, with less dramatic but measurable reductions in lifetime at 85°C and even 55°C. In contrast, the reliability performance of Sn-37Pb is much more stable over time and temperature. The degradation was observed for both SAC alloys on all tested package sizes and board finishes. For the 19-mm SAC105 case, for example, there was a 53% (32%) reduction of characteristic lifetime at 125°C (85°C) compared to room temperature aging. The trends were in the expected directions; namely, the reliability was reduced when using higher aging temperatures, smaller solder balls, and SAC105. The dominant failure mode can be associated with the growth of Cu₆Sn₅ intermetallic compounds during the aging, particularly on the pad side.
Starting Page	1317
Ending Page	1328
Page Count	12
File Size	3299048
File Format	PDF
ISSN	21563950
Volume Number	2
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aging Lead Reliability Isothermal processes Temperature Soldering Temperature measurement solder Board finishes isothermal aging lead-free microstructure reliability SnAgCu
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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