NDLI: Analysis of Thermal Resistance Characteristics of Power LED Module

Content Provider	IEEE Xplore Digital Library
Author	Chien-Ping Wang Shung-Wen Kang Kuan-Min Lin Tzung-Te Chen Han-Kuei Fu Pei-Ting Chou
Copyright Year	1963
Abstract	Multichip LED arrays are widely used for lighting to provide high luminance. Luminous efficacy, lifetime, and color temperature are highly dependent on the temperature at p-n junction. This paper investigated the effects of distance, number of chips, and driving current on the thermal resistance of LED module. Thermal resistance dramatically increased as the distance between LED chips decreased due to significant thermal spreading impedance for heat dissipation from junction to ambient. The parallel-resistance formula substantially underestimated the junction temperature of the LED modules due to significant thermal crowding effect. Thermal boundary can also rise junction temperature as the distance to the board edge decreased in both the two-chip and four-chip modules. Infrared results showed that chip temperatures were highly consistent with thermal resistance measurements under different driving currents.
Sponsorship	IEEE Electron Devices Society
Starting Page	105
Ending Page	109
Page Count	5
File Size	1082763
File Format	PDF
ISSN	00189383
Volume Number	61
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Temperature measurement Light emitting diodes Junctions Electrical resistance measurement Current measurement thermal resistance Junction temperature LED module
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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