NDLI: Fast Thermal Analysis on GPU for 3D ICs With Integrated Microchannel Cooling

Content Provider	IEEE Xplore Digital Library
Author	Zhuo Feng Peng Li
Copyright Year	1993
Abstract	Effective thermal management for 3D integrated circuits (3D ICs) is becoming increasingly challenging due to the ever-increasing power density and chip design complexity; traditional heat sinks are expected to quickly reach their limits for meeting the cooling needs of 3D ICs. Alternatively, the integrated liquid-cooled microchannel heat sink has become one of the most effective solutions. In this paper, we present fast multigrid and block tridiagonally preconditioned graphics processing unit (GPU) based thermal simulation algorithms for 3D ICs. Unlike the CPU-based solver development in which existing sophisticated numerical simulation tools (matrix solvers) can be readily adopted and implemented, GPU-based thermal simulation demands more effort in the algorithm and data structure design phase, and requires careful consideration of GPU's thread/memory organization, data access/communication patterns, arithmetic intensity, as well as its hardware occupancies. As shown by various experimental results, our GPU-based 3D thermal simulation solvers can achieve more than 360× speedups over the best available direct solvers and more than 35× speedups over the CPU-based iterative solvers, without loss of accuracy.
Sponsorship	IEEE Computer Society Association for Computing Machinery (ACM)/SIGDA IEEE Computer Society Technical Committee on Design Automation
Starting Page	1526
Ending Page	1539
Page Count	14
File Size	4768838
File Format	PDF
ISSN	10638210
Volume Number	21
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microchannel Integrated circuit modeling Thermal analysis Graphics processing unit Solid modeling Cooling Computational modeling microchannel cooling 3D integrated circuits full-chip thermal simulation graphics processing units iterative methods massively parallel computing
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering Software Hardware and Architecture

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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