NDLI: Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink

Content Provider	IEEE Xplore Digital Library
Author	Yong Jiun Lee Poh Seng Lee Siaw Kiang Chou
Copyright Year	2011
Abstract	Sectional oblique fins are employed, in contrast to continuous fins, in order to modulate the flow in a microchannel heat sink. The breakage of continuous fin into oblique sections leads to reinitialization of boundary layers and generation of secondary flows that significantly enhance the cooling performance of the heat sink. In addition, an oblique finned microchannel heat sink has the flexibility to tailor local heat transfer performance by varying its oblique fin pitch. Clusters of oblique fins at higher density can be created in order to promote a greater degree of boundary layer redevelopment and secondary flow generation to provide more effective cooling at the high heat-flux region. Thus, the variation of oblique fin pitch can be exploited for hotspot mitigation. Experimental studies of a silicon chip with two hotspot scenarios show that the temperature hike and the temperature difference for the enhanced microchannel heat sink with variable pitch are reduced by as much as 17.1 °C and 15.4 °C, respectively. As a result, temperature distribution across the silicon chip is more uniform. In addition, the associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective hotspot mitigating strategy for the single-phase microchannel heat sink.
Starting Page	1332
Ending Page	1341
Page Count	10
File Size	1784847
File Format	PDF
ISSN	21563950
Volume Number	3
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat sinks Microchannel Heating Heat transfer Silicon Voltage measurement variable pitch Enhanced microchannel hotspot cooling oblique fins
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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