NDLI: Glass–Glass Laser-Assisted Glass Frit Bonding

Content Provider	IEEE Xplore Digital Library
Author	Cruz, R. da Cruz Ranita, J.A. Macaira, J. Ribeiro, F. da Silva, A.M.B. Oliveira, J.M. Fernandes, M.H.F.V. Ribeiro, H.A. Mendes, J.G. Mendes, A.
Copyright Year	2011
Abstract	A novel sealing method is proposed for encapsulating devices comprised of glass substrates. This sealing method is based on applying a glass frit paste cord onto the substrate and then using a laser beam to locally supply the necessary energy to allow the formation of a hermetic bonding layer. A detailed description of the laser bonding technique, the necessary equipment and method, and a preliminary study is carried out. The need to apply mechanical pressure during the bonding step is averted, thus facilitating the manufacturing process. The glass bonding cord obtained by the laser-assisted process was found to have an excellent contact with both substrates and no gas inclusions or voids were detected, indicating that an effective sealing was achieved. Preliminary hermeticity tests of the laser-bonded cells yielded encouraging results. The developed laser-assisted glass frit bonding process is a promising technique for obtaining hermetic sealing of photoelectronic and electrochemical devices, as it allows temperature-sensitive materials to be used inside them.
Starting Page	1949
Ending Page	1956
Page Count	8
File Size	1511514
File Format	PDF
ISSN	21563950
Volume Number	2
Issue Number	12
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Bonding Substrates Sealing materials Lasers Joining processes lead-free glass frit Glass substrate laser joining
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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