NDLI: Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards

Content Provider	IEEE Xplore Digital Library
Author	Songping Wu Jun Fan
Copyright Year	1964
Abstract	Crosstalk among vias is a significant problem in high-speed multilayer printed circuit boards (PCBs), deteriorating signal quality and increasing jitter, especially when circuit density is high. In this paper, a two-step via crosstalk evaluation procedure is proposed. A fast approach for crosstalk estimation is developed for net screening as the first step. Then, more accurate but more time-consuming modeling can be performed for critical nets or the problematic nets identified in the screening. The main contribution of this study includes the analytical prediction of crosstalk among vias based on an infinite parallel-plane assumption. Its effectiveness and efficiency to predict the trends in the crosstalk among vias in practical PCB designs are demonstrated.
Sponsorship	IEEE Electromagnetic Compatibility Society
Starting Page	413
Ending Page	420
Page Count	8
File Size	676869
File Format	PDF
ISSN	00189375
Volume Number	54
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Crosstalk Transmission line matrix methods Inductance Integrated circuit modeling Impedance Nonhomogeneous media Geometry via models Physics-based via circuit model printed circuit board (PCB) signal integrity via crosstalk
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Condensed Matter Physics Electrical and Electronic Engineering

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