NDLI: Experimental Validations of a Simple PCB Interconnect Model for High-Rate Signal Integrity

Content Provider	IEEE Xplore Digital Library
Author	Eudes, T. Ravelo, B. Louis, A.
Copyright Year	1964
Abstract	This paper is devoted to investigating experimental validations of a simple modeling method of PCB interconnects for high-speed signal integrity and electromagnetic compatibility applications. Based on the theoretical approach using the extraction method of the interconnect per-unit-length RLCG parameters, the reduced models of the corresponding transfer function, -parameters, and access and transfer impedances are also established. The methodology describing the different steps of the technique proposed for practical use cases in ultra wideband is established. To verify the effectiveness of the concept under consideration, time-domain validations from the frequency-measured data are realized by using printed circuit board microstrip interconnect lines with micrometers width and millimeters long. Therefore, the model was first validated experimentally, and with electromagnetic simulations, in frequency domain via comparison of -parameters and -matrix from dc to some gigahertz. It was found that relative errors lower than 1 dB were evaluated between the insertion loss of the models, simulations, and measurements. Then, by injecting noisy digital- and mixed-signals with 1 Gigasymbol/s, relative errors of lower than 1% were evaluated by considering the time-domain responses. Compared to the existing interconnect modeling tools, the developed one presents a high accuracy, simplicity, and very less computation time.
Sponsorship	IEEE Electromagnetic Compatibility Society
Starting Page	397
Ending Page	404
Page Count	8
File Size	692724
File Format	PDF
ISSN	00189375
Volume Number	54
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Scattering parameters Computational modeling Time domain analysis Integrated circuit modeling Transmission line matrix methods Mathematical model time-domain measurement ABCD-matrix reduced model high-rate application printed circuit board (PCB) interconnect signal integrity (SI)
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Condensed Matter Physics Electrical and Electronic Engineering

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