NDLI: Three-Dimensional Stacked Multilayer Graphene Interconnects

Content Provider	IEEE Xplore Digital Library
Author	Tianhua Yu Chen-Wei Liang Changdong Kim Eui-Sang Song Bin Yu
Copyright Year	1980
Abstract	We experimentally demonstrate stacked multilayer graphene (MLG) (s-MLG) as a new material system for high-performance carbon interconnects. Electrical performance is systematically characterized. We discover that the wire sheet resistance of s-MLG decreases with more layers stacking and shows better conductivity than that of the exfoliated MLG sample with the same layer numbers. The contact resistance of the s-MLG samples was calculated and confirmed using two different methods. It is demonstrated that a decrease in the intrinsic resistivity of s-MLG with increasing layer number is discovered; however, contact resistance will be saturated with more stacked layer numbers.
Sponsorship	IEEE Electron Devices Society
Starting Page	1110
Ending Page	1112
Page Count	3
File Size	218704
File Format	PDF
ISSN	07413106
Volume Number	32
Issue Number	8
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conductivity Wires Resistance Contact resistance Copper Nonhomogeneous media Electrical resistance measurement stacked multilayer graphene (s-MLG) Contact resistivity interconnect sheet resistance
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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