NDLI: Determination of Acceleration Factor in Predicting the Field Life of Plated Through Holes From Thermal Stress Data

Content Provider	IEEE Xplore Digital Library
Author	Jingsong Xie Jing-Jing He Yuan Zhang Freda, M.
Copyright Year	1999
Abstract	Accelerated thermal stress tests nowadays have widely been used in qualification and reliability assessment of printed wiring boards (PWBs). Predicting the field life of plated through holes (PTHs) from test data has been a primary goal of this type of testing. Understanding the PTH cycles to failure (CTF) versus temperature relationship and having a good estimate of acceleration factor (AF) not only expedites the data processing process but also helps in optimizing test conditions and minimizing the number of tests, and hence, reducing the test cost. In this paper, three different PTH CTF-temperature models, including an inverse power law (IPL) model, an IPC model, and an enhanced PTH fatigue-life prediction model, are discussed and evaluated in their effectiveness of determining acceleration factors for the purpose of PTH field life prediction under different test conditions. In addition, using the third model, AF influencing factors, including PTH geometric dimensions, PWB glass transition temperatures (Tg), and the temperature dependency of PWB material properties, are also discussed to provide information for accelerated test design in PWB qualification and reliability assessment.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	634
Ending Page	641
Page Count	8
File Size	547275
File Format	PDF
ISSN	15213331
Volume Number	31
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal stresses Acceleration Thermal factors Life estimation Predictive models Life testing Qualifications Temperature dependence Wiring Data processing reliability assessment Field life plated through holes printed wiring board
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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