NDLI: Nano-Underfills for High-Reliability Applications in Extreme Environments

Content Provider	IEEE Xplore Digital Library
Author	Lall, P. Islam, S. Guoyun Tian Suhling, J.C.
Copyright Year	1999
Abstract	Silica particles are used as a filler material in electronic underfills to reduce coefficient of thermal expansion of the underfill-epoxy matrix. In traditional underfills, the size of silica particles is in the micrometer range. Reduction in particle sizes into the nanometer range has the potential of attaining higher volume fraction particle loading in the underfills and greater control over underfill properties for higher reliability applications. Presently, no-flow underfills have very low or no filler content because micron-size filler particles hinder solder joint formation. Nano-silica underfills have the potential of attaining higher filler loading in no-flow underfills without hindering solder interconnect formation. In this paper, property prediction models based on representative volume element (RVE) and modified random spatial adsortion have been developed. The models can be used for development of nano-silica underfills with desirable thermo-mechanical properties. Temperature dependent thermo-mechanical properties of nano-underfills have been evaluated and correlated with models in a temperature range of -175degC to 150degC. Properties investigated include, temperature dependent stress-strain, creep and stress relaxation behavior. Nano-underfills on 63Sn37Pb eutectic and 95.5Sn3.5Ag1.0Cu leadfree flip-chip devices have been subjected to thermal shock tests in the range of -55degC to 125degC and -55degC to 150degC, respectively. The trade-offs between using nano-fillers instead of micron-fillers on thermo-mechanical properties and reliability has been benchmarked.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	114
Ending Page	125
Page Count	12
File Size	5811754
File Format	PDF
ISSN	15213331
Volume Number	31
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-03-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Temperature dependence Silicon compounds Temperature distribution Thermal expansion Size control Soldering Predictive models Creep Thermal stresses system in package (SIP) Coefficient of thermal expansion (CTE) representative volume element (RVE)
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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Temperature and Time-dependent Property Prediction and Validation for Nano-Underfills using RSA based RVE Algorithms

Nano-Underfills for High-Reliability Applications in Extreme Environments

Does underfilling enhance BGA reliability?

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Reliability Optimization of Stacked System-in-Package Using FEA

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Evaluation of reworkable underfills for area array packaging encapsulation

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Nano-Underfills for High-Reliability Applications in Extreme Environments

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