NDLI: A Mechanical, Electrical, Thermal Coupled-Field Simulation of a Sphere-Plane Electrical Contact

Content Provider	IEEE Xplore Digital Library
Author	Monnier, A. Froidurot, B. Jarrige, C. Teste, P. Meyer, R.
Copyright Year	1999
Abstract	The purpose of this paper is to present a numerical simulation of the behavior of a sphere-plane electrical contact when a high current flows through it. A sequential coupling allows to study the interactions between mechanical, electrical and thermal phenomena occurring under a high current flow (intensity between 20 and 60 kA). The structural deformations and the voltage and temperature distributions are computed with the help of the finite element method via the ANSYS software. The 2D axisymmetric geometry considers a smooth sphere pressed on a smooth plane. The model takes into account the temperature dependency of material properties such as Young's modulus, hardness, electrical and thermal conductivities, specific heat, and coefficient of thermal expansion. The influence of the current intensity, the contact force, and the duration of the current flow on the potential distribution has been studied. As they are coupled, all phenomena are affected by heat generation variations and every phenomenon has an effect on all others and so on. In some particular conditions, analytical calculations make it possible to validate the simulation. Comparisons with experimental results are realized with several contact forces.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	787
Ending Page	795
Page Count	9
File Size	1760322
File Format	PDF
ISSN	15213331
Volume Number	30
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Couplings Contacts Thermal conductivity Thermal expansion Numerical simulation Voltage Temperature distribution Distributed computing Finite element methods Geometry sphere-plane Ag electrical contact oxygen free high conductivity (OFHC) Cu simulation
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A mechanical, electrical, thermal coupled-field simulation of a sphere-plane electrical contact

Coupled Thermal Electrical Finite Element Analysis of Power Contacts Used in High Speed Differential Connectors

A non-overlapping domain decomposition method for fully coupled electrical-thermal contact problems

A modeling approach of a coupled problem between electrical current and its thermal effects

Electrical Contact Resistance in Thin $({leq}{rm 0.5}~mu{rm m})$ Gold Plated Contacts: Effect of Gold Plating Thickness

Simulation of electric and thermal fields of high voltage interrupter vacuum chamber

Finite element models for simulation of wear in electrical contacts

A Coupled-Field Simulation of an Electrical Contact during Resistance Welding

Steady state contact pressures in electrical contacts

A Mechanical, Electrical, Thermal Coupled-Field Simulation of a Sphere-Plane Electrical Contact

Similar Documents

A mechanical, electrical, thermal coupled-field simulation of a sphere-plane electrical contact

Coupled Thermal Electrical Finite Element Analysis of Power Contacts Used in High Speed Differential Connectors

A non-overlapping domain decomposition method for fully coupled electrical-thermal contact problems

A modeling approach of a coupled problem between electrical current and its thermal effects

Electrical Contact Resistance in Thin $({leq}{rm 0.5}~mu{rm m})$ Gold Plated Contacts: Effect of Gold Plating Thickness

Simulation of electric and thermal fields of high voltage interrupter vacuum chamber

Finite element models for simulation of wear in electrical contacts

A Coupled-Field Simulation of an Electrical Contact during Resistance Welding

Steady state contact pressures in electrical contacts

A Mechanical, Electrical, Thermal Coupled-Field Simulation of a Sphere-Plane Electrical Contact