NDLI: Compact Harmonic Filter Design and Fabrication Using IPD Technology

Content Provider	IEEE Xplore Digital Library
Author	Lianjun Liu Shun-Meen Kuo Abrokwah, J. Ray, M. Maurer, D. Miller, M.
Copyright Year	1999
Abstract	An integrated passive device (IPD) technology has been developed to meet the ever increasing needs of size and cost reduction in radio front-end transceiver module applications. Electromagnetic (EM) simulation was used extensively in the design of the process technology and the optimization of inductor and harmonic filter designs and layouts. Parameters such as inductor shape, inner diameter, metal thickness, metal width, and substrate thickness have been optimized to provide inductors with high quality factors. The technology includes 1) a thick plated gold metal process to reduce resistive loss; 2) MIM capacitors using PECVD SiN dielectric layer; 3) airbridges for inductor underpass and capacitor pick-up; and 4) a 10 mil finished GaAs substrate to improve inductor quality factor. Both lumped element circuit simulations and electromagnetic (EM) simulations have been used in the harmonic filter circuit designs for high accuracy and fast design cycle time. This paper will present the EM simulation calibration and demonstrate the importance of using EM simulation in the filter design in order to achieve first-time success in wafer fabrication. The fabricated IPD devices have insertion loss of 0.5 dB and harmonic rejections of 30dB with die size of 1.42 mm for high band (1710 MHz-1910 MHz) and 1.89 mm for low band (824-915 MHz) harmonic filters.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	556
Ending Page	562
Page Count	7
File Size	1393235
File Format	PDF
ISSN	15213331
Volume Number	30
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Harmonic filters Fabrication Inductors Circuit simulation Dielectric substrates Q factor Dielectric losses MIM capacitors Costs Transceivers wireless handset Front-end transceiver module harmonic filters integrated passive devices (IPDs)
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Compact harmonic filter design and fabrication using IPD technology

Ultra-compact inductive coupled UHF tunable filter

Design and Industrialisation of Solidly-Mounted BAW filters

Design and fabrication of suspended high Q MIM capacitors by wafer level packaging technology

Design and fabrication of a compact gaas ipd balun.

A 5-GHz silicon bipolar radio transceiver front-end

A compact 802.11b/g WLAN front-end module with integrated passive devices on modified ceramic substrate

An optimized process of high-performance integrated passive devices (IPDs) on SI-GaAs substrate for RF applications

High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)

Compact Harmonic Filter Design and Fabrication Using IPD Technology

Similar Documents

Compact harmonic filter design and fabrication using IPD technology

Ultra-compact inductive coupled UHF tunable filter

Design and Industrialisation of Solidly-Mounted BAW filters

Design and fabrication of suspended high Q MIM capacitors by wafer level packaging technology

Design and fabrication of a compact gaas ipd balun.

A 5-GHz silicon bipolar radio transceiver front-end

A compact 802.11b/g WLAN front-end module with integrated passive devices on modified ceramic substrate

An optimized process of high-performance integrated passive devices (IPDs) on SI-GaAs substrate for RF applications

High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)

Compact Harmonic Filter Design and Fabrication Using IPD Technology