NDLI: The Influence of Substrate Enhancement on Moisture Sensitivity Level (MSL) Performance for Green PBGA Packages

Content Provider	IEEE Xplore Digital Library
Author	Lin, T.Y. Pecht, M.G. Das, D. Kiat Choon Teo
Copyright Year	1999
Abstract	As the electronics industry migrates to the lead- and halogen-free (green) packages, many of the materials used in plastic ball-grid array (PBGA) substrates, in particular the molding compounds and die attaches, will have to be improved. The moisture sensitivity level (MSL) performance of the large nongreen PBGA packages are typically reduced by at least one JEDEC/IPC level at the lead-free reflow temperature of 260degC. Common failure mechanisms of traditional large size PBGA packages include popcorning, as well as delamination and cracks between the solder mask/copper interface in the multiple layer substrates. In this paper, the interfacial adhesion of traditional and advanced substrate materials and processing technologies are presented based on reliability tests of various PBGA packages subject to moisture soaking followed by reflow soldering at 260degC. It was found that substrate failures with delamination at the solder mask/copper interface were dramatically improved by introducing advanced materials and processes for multiple-layer substrates. However, the partial or full delamination at the mold compound/solder mask interface could still be observed after lead-free reflow soldering. There is an urgent need to improve the adhesion between mold compound/solder mask in order to achieve high MSL performance of large size and green PBGA packages
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	522
Ending Page	527
Page Count	6
File Size	3638500
File Format	PDF
ISSN	15213331
Volume Number	29
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Electronics packaging Environmentally friendly manufacturing techniques Lead Delamination Copper Adhesives Reflow soldering Electronics industry Plastic packaging plastic ball-grid array (PBGA) Green electronics lead free soldering moisture sensitivity level (MSL)
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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