NDLI: Film transfer and bonding techniques for covering single-chip ejector array with microchannels and reservoirs

Content Provider	IEEE Xplore Digital Library
Author	Jae Wan Kwon Hongyu Yu Eun Sok Kim
Copyright Year	1992
Abstract	This paper describes a novel covering technique for an MEMS ejector array that is integrated with liquid reservoirs and microchannels on a single chip. The covering technique is based on wicking of a low viscous epoxy through the gap between the ejector wafer and a plate containing a parylene film, and allows the integrated ejector array to be fully covered by the parylene film with excellent uniformity, repeatability and yield. The technique is batch-processible and is suitable to cover many microfluidic systems with a thin film. The parylene film is tightly attached to the ejector array chip (with excellent bonding strength owing to the epoxy), so that liquid is automatically brought into the ejectors from the reservoirs through the microchannels (due to capillary force), as the ejectors shoot out liquid droplets. This automatic liquid supply makes the liquid level (in the ejector) be maintained constant throughout the entire ejection process until more than 90% of the liquid stored in the reservoir is delivered to the ejector through the microchannel. This paper describes also a number of other covering methods that we have experimentally tried, and compares those with the new covering technique. [1459].
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	1399
Ending Page	1408
Page Count	10
File Size	2742104
File Format	PDF
ISSN	10577157
Volume Number	14
Issue Number	6
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-12-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microchannel Reservoirs Microfluidics Wafer bonding Glass Micromechanical devices Substrates Lab-on-a-chip Chemicals Transistors parylene bonding Acoustic droplet ejector enclosed microchannels and reservoirs epoxy wicking film cover integrated ejector array microfluidic systems
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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