NDLI: Are you ready for lead-free electronics?

Content Provider	IEEE Xplore Digital Library
Author	Eveloy, V. Ganesan, S. Fukuda, Y. Ji Wu Pecht, M.G.
Copyright Year	1999
Abstract	An expedient transition to lead-free electronics has become necessary for most electronics industry sectors, considering the European directives [The Waste of Electrical and Electronic Equipment (WEEE) directive requires manufacturers to reduce the disposal waste of electrical and electronic products by reuse, recycling, and other forms of recovery. The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) legislation restricts the use of lead, as well as cadmium, mercury, hexavalent chromium, and two halide-containing flame retardants, namely polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), in eight of the ten product categories identified in the WEEE directive. Unlike for WEEE, whereby EU member states are free to set more severe national legislation satisfying the WEEE directive requirements, RoHS is a single market directive. Both the WEEE and RoHS directives will become effective on July 1, 2006] , other possible legislative requirements, and market forces , . In fact, the consequences of not meeting the European July 2006 deadline for transition to lead-free electronics may translate into global market losses. Considering that lead-based electronics have been in use for over 40 years, the adoption of lead-free technology represents a dramatic change. The industry is being asked to adopt different electronic soldering materials , component termination metallurgies, and printed circuit board finishes. This challenge is accompanied by the need to requalify component-board assembly and rework processes, as well as implement test, inspection, and documentation procedures. In addition, lead-free technology is associated with increased materials, design, and manufacturing costs. [The cost of implementing the RoHS directive in the EU has been estimated to be US$ 20Bn . Intel Corporation's efforts to remove lead from its chips have been estimated to cost the company over US$ 100 million so far]. The use of lead-free materials and processes has also prompted new reliability concerns , as a result of different alloy metallurgies and higher assembly process temperatures relative to tin-lead soldering. This paper provides guidance to efficiently implement the lead-free transition process that accounts for the company's market share, associated exemptions, technological feasibility, product reliability requirements, and cost. Lead-free compliance, part and supplier selection, manufacturing, and education and training are addressed. The guidance is presented in the form of answers to key questions.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	884
Ending Page	894
Page Count	11
File Size	422030
File Format	PDF
ISSN	15213331
Volume Number	28
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Consumer electronics Electronic waste Costs Industrial electronics Electronics industry Electronic equipment Legislation Soldering tin–lead soldering Lead-free RoHS
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

WEEE, RoHS, and what you must do to get ready for lead-free electronics

Lead-free soldering in the Japanese electronics industry

Examining the environmental impact of lead-free soldering alternatives

Reliability Aspects of Lead-Free Soldering in Industrial Applications

Examining the environmental impact of lead-free soldering alternatives

The current status of lead-free solder alloys

RoHS-what is it?

The impact of lead-free legislation exemptions on the electronics industry

Present status of transition to Pb-free soldering

Are you ready for lead-free electronics?

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