NDLI: Superlattice microrefrigerators fusion bonded with optoelectronic devices

Content Provider	IEEE Xplore Digital Library
Author	Yan Zhang Gehong Zeng Piprek, J. Bar-Cohen, A. Shakouri, A.
Copyright Year	1999
Abstract	A three-dimensional (3-D) electrothermal model was developed to study the InP-based thin-film In/sub 0.53/Ga/sub 0.47/As/In/sub 0.52/Al/sub 0.48/As superlattice (SL) microrefrigerators for various device sizes, ranging from 40/spl times/40 to 120/spl times/120/spl mu/m /sup 2/. We discussed both the maximum cooling and cooling power densities (CPDs) for experimental devices, analyzed their nonidealities, and proposed an optimized structure. The simulation results demonstrated that the experimental devices with an optimized structure can achieve a maximum cooling of 3/spl deg/C, or equivalently, a CPD over 300W/cm/sup 2/. Furthermore, we found it was possible to achieve a maximum cooling of over 10/spl deg/C; equivalently, a CPD over 900W/cm/sup 2/, when the figure of merit (ZT) of InGaAs/InAlAs SL was enhanced five times with nonconserved lateral momentum structures. Besides monolithic growth, we also proposed a fusion bonding scheme to simply bond the microrefrigerator chip on the back of the hot spots, defined as two-chip integration model in this paper. The cooling effect of this model was analyzed using ANSYS simulations.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	658
Ending Page	666
Page Count	9
File Size	2232868
File Format	PDF
ISSN	15213331
Volume Number	28
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Superlattices Bonding Optoelectronic devices Cooling Temperature Tellurium Thermal conductivity Thermoelectricity Electrothermal effects Wavelength division multiplexing thermoelectric (TE) Cooling power density (CPD) electrothermal simulation integration maximum cooling microrefrigerators superlattice (SL) thermionic
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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