NDLI: Recovery of stiction-failed MEMS structures using laser-induced stress waves

Content Provider	IEEE Xplore Digital Library
Author	Gupta, V. Snow, R. Wu, M.C. Jain, A. Tsai, J.
Copyright Year	1992
Abstract	Stiction, or adhesion between suspended structures and the underlying surface, is a hurdle in batch fabricating long, freestanding MEMS structures. A novel technique is presented in this paper to release stiction. In this technique, a nanosecond rise time stress wave is launched on the backside of the Si substrate by impinging a 2.5 ns-duration Nd:YAG laser pulse onto a 3-mm-dia area. The compressive stress wave propagates through the Si substrate and arrives at the site of several stiction-failed cantilevers on the front Si surface. The compressive stress wave propagates through the cantilevered structures and is reflected into a tensile wave from their free surfaces. The returning tensile wave pries off the interface, releasing the cantilevers. The procedure is demonstrated on a MEMS chip with stiction-failed cantilevers with varying lengths from 100 /spl mu/m to 1000 /spl mu/m. The threshold laser energy to release stiction increased linearly with cantilever lengths. Beam recovery began at a laser fluence of 11 kJ/m/sup 2/ laser energy. 70% of the tested beams had been recovered after impingement with a fluence of 26 kJ/m/sup 2/. After the highest applied laser fluence of 40 kJ/m/sup 2/, 90% of the tested beams had been recovered. No damage to the structures or surrounding features was observed below 40 kJ/m/sup 2/. Because of rather low laser fluence, no thermal damage to the back surface of Si was noted. Since it literally takes few seconds to release stiction, the proposed technique can be implemented in MEMS foundry, and for repair of in-use stiction failed MEMS devices.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	696
Ending Page	700
Page Count	5
File Size	1159300
File Format	PDF
ISSN	10577157
Volume Number	13
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Compressive stress Laser beams Optical propagation Surface waves Testing Adhesives Optical pulses Surface emitting lasers Foundries
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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