NDLI: A low-temperature thin-film electroplated metal vacuum package

Content Provider	IEEE Xplore Digital Library
Author	Stark, B.H. Najafi, K.
Copyright Year	1992
Abstract	This paper presents a packaging technology that employs an electroplated nickel film to vacuum seal a MEMS structure at the wafer level. The package is fabricated in a low-temperature (<250/spl deg/C) 3-mask process by electroplating a 40-/spl mu/m-thick nickel film over an 8-/spl mu/m sacrificial photoresist that is removed prior to package sealing. A large fluidic access port enables an 800/spl times/800 /spl mu/m package to be released in less than three hours. MEMS device release is performed after the formation of the first level package. The maximum fabrication temperature of 250/spl deg/C represents the lowest temperature ever reported for thin film packages (previous low /spl sim/400/spl deg/C). Implementation of electrical feedthroughs in this process requires no planarization. Several mechanisms, based upon localized melting and Pb/Sn solder bumping, for sealing low fluidic resistance feedthroughs have been investigated. This package has been fabricated with an integrated Pirani gauge to further characterize the different sealing technologies. These gauges have been used to establish the hermeticity of the different sealing technologies and have measured a sealing pressure of /spl sim/1.5 torr. Short-term (/spl sim/several weeks) reliability data is also presented.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	147
Ending Page	157
Page Count	11
File Size	1094360
File Format	PDF
ISSN	10577157
Volume Number	13
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-04-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transistors Packaging Wafer scale integration Nickel Temperature Vacuum technology Seals Micromechanical devices Resists Microelectromechanical devices
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging

On-Wafer Monolithic Encapsulation by Surface Micromachining With Porous Polysilicon Shell

A Method for Wafer-Scale Encapsulation of Large Lateral Deflection MEMS Devices

Thin-Film Encapsulated RF MEMS Switches

Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs

Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding

Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

The fabrication of all-diamond packaging panels with built-in interconnects for wireless integrated microsystems

Microrivets for MEMS packaging: concept, fabrication, and strength testing

A low-temperature thin-film electroplated metal vacuum package

Similar Documents

A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging

On-Wafer Monolithic Encapsulation by Surface Micromachining With Porous Polysilicon Shell

A Method for Wafer-Scale Encapsulation of Large Lateral Deflection MEMS Devices

Thin-Film Encapsulated RF MEMS Switches

Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs

Wafer-Level Vacuum Packaging for MEMS Resonators Using Glass Frit Bonding

Low-Temperature Monolithic Encapsulation Using Porous-Alumina Shell Anodized on Chip

The fabrication of all-diamond packaging panels with built-in interconnects for wireless integrated microsystems

Microrivets for MEMS packaging: concept, fabrication, and strength testing

A low-temperature thin-film electroplated metal vacuum package