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Stacked modular package

Content Provider	IEEE Xplore Digital Library
Author	Pienimaa, S.K. Miettinen, J. Ristolainen, E.
Copyright Year	1999
Abstract	This paper reports on a vertical package developed to enable size reduction of electronics for miniaturized products. The features of portable and handheld devices have increased whereas size is continually reduced. System-on-a-chip is the most effective size reduction approach, but is not a good business when excessively complex and oversized low yielding chips are required. A vertical package is a cost-effective solution to save placement and routing area on the board. Furthermore, a vertical module enables the benefit of several IC processes in the same module. The goal was to develop a method to produce a stacked modular package on a small scale, and to verify the feasibility of the solution. The main focus has been to test the bare die connections to the interposer and the vertical connections between interposers. The structure enables also, e.g., thin discretes, and passive arrays to be assembled on the interposer, thus enabling system-in-package (SiP) solutions. The method has been tested using thin daisy chain dice and daisy chain vertical interconnections. The dimensions of the developed six chip modules were 14/spl times/8/spl times/0.8-1 mm. This module consists of three aramid-epoxy interposers, each containing two chips. The interposers were either 100 or 150-/spl mu/m thick, and the chips were thinned down to 90 /spl mu/s. Eutectic tin-lead solder bumps were used to mount the flip chips to the interposer. Solder-coated polymer spheres were used to stack the interposers on top of each other. The developed stacking process and vertical area interconnections by plastic core balls give good reliability and uniform stand-off height. Thermal cycling test +125/-40/spl deg/C until 2000 cycles proved reliability of the structure. Flip-chip failures were found after 500 cycles and only 1 of 32 vertical connection failures occurred during the test. Furthermore, this was caused, at least partly, by excess solder. Plastic ball as interconnection media between stacked layers gives good reliability and uniform stand-off height.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	461
Ending Page	466
Page Count	6
File Size	1269485
File Format	PDF
ISSN	15213323
Volume Number	27
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Electronics packaging Plastics Handheld computers System-on-a-chip Routing Assembly systems Flip chip Polymers Stacking
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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