NDLI: System-level reliability assessment of mixed-signal convergent microsystems

Content Provider	IEEE Xplore Digital Library
Author	Pucha, R.V. Hegde, S. Damani, M. Tunga, K. Perkins, A. Mahalingam, S. Ramakrishna, G. Lo, G.C. Klein, K. Ahmad, J. Sitaraman, S.K.
Copyright Year	1999
Abstract	The next-generation convergent microsystems, based on system-on-package (SOP) technology, require up-front system-level design-for-reliability approaches and appropriate reliability assessment methodologies to guarantee the reliability of digital, optical, and radio frequency (RF) functions, as well as their interfaces. Systems approach to reliability requires the development of: i) physics-based reliability models for various failure mechanisms associated with digital, optical, and RF Functions, and their interfaces in the system; ii) design optimization models for the selection of suitable materials and processing conditions for reliability, as well as functionality; and iii) system-level reliability models understanding the component and functional interaction. This paper presents the reliability assessment of digital, optical, and RF functions in SOP-based microsystems. Upfront physics-based design-for-reliability models for various functional failure mechanisms are presented to evaluate various design options and material selection even before the prototypes are made. Advanced modeling methodologies and algorithms to accommodate material length scale effects due to enhanced system integration and miniaturization are presented. System-level mixed-signal reliability is discussed thorough system-level reliability metrics relating component-level failure mechanisms to system-level signal integrity, as well as statistical aspects.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	438
Ending Page	452
Page Count	15
File Size	1427378
File Format	PDF
ISSN	15213323
Volume Number	27
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Failure analysis Optical sensors Integrated optics Thermal stresses Electronic packaging thermal management Biomedical optical imaging Materials reliability Optical materials Optical refraction
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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