NDLI: 3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

Content Provider	IEEE Xplore Digital Library
Author	Tentzeris, M.M. Laskar, J. Papapolymerou, J. Pinel, S. Palazzari, V. Li, R. DeJean, G. Papageorgiou, N. Thompson, D. Bairavasubramanian, R. Sarkar, S. Lee, J.-H.
Copyright Year	1999
Abstract	Electronics packaging evolution involves system, technology, and material considerations. In this paper, we present a novel three-dimensional (3-D) integration approach for system-on-package (SOP)-based solutions for wireless communication applications. This concept is proposed for the 3-D integration of RF and millimeter (mm) wave embedded functions in front-end modules by means of stacking substrates using liquid crystal polymer (LCP) multilayer and /spl mu/BGA technologies. Characterization and modeling of high-Q RF inductors using LCP is described. A single-input-single-output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, two dual-polarization 2/spl times/1 antenna arrays operating at 14 and 35 GHz, and a WLAN IEEE 802.11a-compliant compact module (volume of 75/spl times/35/spl times/0.2 mm/sup 3/) have been fabricated on LCP substrate, showing the great potential of the SOP approach for 3-D-integrated RF and mm wave functions and modules.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	332
Ending Page	340
Page Count	9
File Size	939464
File Format	PDF
ISSN	15213323
Volume Number	27
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency Millimeter wave technology Liquid crystal polymers Millimeter wave communication Electronics packaging Crystalline materials Wireless communication Stacking Nonhomogeneous media Inductors
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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