NDLI: Design, fabrication, and measurement of high-sensitivity piezoelectric microelectromechanical systems accelerometers

Content Provider	IEEE Xplore Digital Library
Author	Li-Peng Wang Wolf Jr., R.A. Yu Wang Deng, K.K. Zou, L. Davis, R.J. Trolier-McKinstry, S.
Copyright Year	1992
Abstract	Microelectromechanical systems (MEMS) accelerometers based on piezoelectric lead zirconate titanate (PZT) thick films with trampoline or annular diaphragm structures were designed, fabricated by bulk micromachining, and tested. The designs provide good sensitivity along one axis, with low transverse sensitivity and good temperature stability. The thick PZT films (1.5-7 /spl mu/m) were deposited from an acetylacetonate modified sol-gel solution, using multiple spin coating, pyrolysis, and crystallization steps. The resulting films show good dielectric and piezoelectric properties, with P/sub r/ values >20 /spl mu/C/cm/sup 2/, /spl epsiv//sub r/>800, tan/spl delta/<3%, and \|e/sub 31,f/\| values >6.5 C/m/sup 2/. The proof mass fabrication, as well as the accelerometer beam definition step, was accomplished via deep reactive ion etching (DRIE) of the Si substrate. Measured sensitivities range from 0.77 to 7.6 pC/g for resonant frequencies ranging from 35.3 to 3.7 kHz. These accelerometers are being incorporated into packages including application specific integration circuit (ASIC) electronics and an RF telemetry system to facilitate wireless monitoring of industrial equipment.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	433
Ending Page	439
Page Count	7
File Size	1122265
File Format	PDF
ISSN	10577157
Volume Number	12
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Microelectromechanical systems Accelerometers Piezoelectric films Micromechanical devices Titanium compounds Thick films Micromachining System testing Temperature sensors
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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