NDLI: Progress in the methodologies for the electrical modeling of interconnects and electronic packages

Content Provider	IEEE Xplore Digital Library
Author	Ruehli, A.E. Cangellaris, A.C.
Copyright Year	1963
Abstract	The rapid growth of the electrical modeling and analysis of the interconnect structure, both at the electronic chip and package level, can be attributed to the increasing importance of the electromagnetic properties of the interconnect circuit on the overall electrical performance of state-of-the-art very large scale integration (VLSI) systems. With switching speeds well below 1 ns in today's gigahertz processors, and VLSI circuit complexity exceeding the 100 million transistors per chip mark, power and signal distribution is characterized by multigigahertz bandwidth pulses propagating through a tightly coupled three-dimensional wiring structure that exhibits resonant behavior at the upper part of the spectrum. Consequently, in addition to the inductive and capacitive coupling, present between adjacent wires across the entire frequency bandwidth, distributed electromagnetic effects, manifested as interconnect-induced delay, reflection, radiation, and long-range nonlocal coupling, become prominent at high frequencies, with a decisive impact of overall system performance. The electromagnetic nature of such high-frequency effects, combined with the geometric complexity of the interconnect structure, make the electrical design of today's performance-driven systems extremely challenging. Its success is heavily dependent on the availability of sophisticated electromagnetic modeling methodologies and computer-aided design tools. This paper presents an overview of the different approaches employed today for the development of an electromagnetic modeling and simulation framework that can effectively tackle the complexity of the interconnect circuit and facilitate its design. In addition to identifying the current state of the art, an assessment is given of the challenges that lie ahead in the signal integrity-driven electrical design of tomorrow's performance- and/or portability-driven, multifunctional ULSI systems.
Sponsorship	IEEE Publication
Starting Page	740
Ending Page	771
Page Count	32
File Size	406216
File Format	PDF
ISSN	00189219
Volume Number	89
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Electromagnetic modeling Very large scale integration Electromagnetic coupling Electromagnetic radiation Signal processing Bandwidth Coupling circuits Frequency Electromagnetic analysis
Content Type	Text
Resource Type	Article
Subject	Computer Science Electrical and Electronic Engineering

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