NDLI: Copper lead frame: an ultimate solution to the reliability of BLP package

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Copper lead frame: an ultimate solution to the reliability of BLP package

Content Provider	IEEE Xplore Digital Library
Author	Kwang-Seong Choi Teck-Gyu Kang Ik-Seong Park Jong-Hyun Lee Ki-Bon Cha
Copyright Year	1999
Abstract	Copper lead frame was chosen as an on-board reliability enhancement for the BLP (bottom leaded plastic) package. Adopting the copper lead frame needed a verification process for the package reliability because of its high affinity with oxygen that degrades package reliability. A series of tests were performed to select the best copper material and to determine the adhesion index parameter. The experimental results showed that the adhesion strength between the copper lead frame and EMC (epoxy molding compound) was affected by alloy composition, oxide layer thickness, and cupric/cuprous oxide ratio, Among them, the adhesion index parameter proved to be the cupric/cuprous oxide ratio. When it falls between 0.2-0.3, the highest adhesion strength was obtained regardless of alloy composition and oxide thickness. From the adhesion test results, the Cr-Zr-Cu copper alloy was employed as the lead frame for the 54-pin BLP package. The package reliability and on-board reliability tests including surface mountability, mechanical robustness, and solder joint reliability were carried out to compare the 54-pin BLP package, with Cr-Zr copper alloy and alloy 42 lead frame.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	32
Ending Page	38
Page Count	7
File Size	562062
File Format	PDF
ISSN	1521334X
Volume Number	23
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Copper alloys Plastic packaging Degradation Materials testing Performance evaluation Lead compounds Electromagnetic compatibility Robustness Soldering
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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