NDLI: Residual stresses in plastic IC packages during surface mounting process preceded by moisture soaking test

Content Provider	IEEE Xplore Digital Library
Author	Sung Yi Jing Sua Goh Ji Cheng Yang
Copyright Year	1994
Abstract	In the present study, moisture and temperature distributions and residual stresses in plastic encapsulated integrated circuit (IC) packages are evaluated in order to assess product reliability. Finite element analyses are utilized to calculate hygro-thermally induced deformations and stresses in plastic IC packages during the surface mounting process preceded by the moisture soaking test. Residual stresses developed in thin lead-on-chip (LOG) thin small outline packages (TSOP) during the reflow soldering process preceded by the 168 h 85/spl deg/C/85% RH moisture soaking test have been studied. Numerical results showed that substantially high positive stresses /spl sigma//sub z/ arose in the silicon chip and the leadframe while negative stresses were observed in the encapsulant below the chip when TSOP packages were exposed to the reflow soldering process. Such opposite stress development in the silicon chip and encapsulant below the chip may result in the delamination and popcorn crack. The results also showed that the magnitude of residual stresses in IC packages depended not only on the magnitude of loading but also on the loading history due to the hygro-thermo-viscoelastic behavior of plastic mold compound materials.
Sponsorship	IEEE Computer Society
Starting Page	247
Ending Page	255
Page Count	9
File Size	200738
File Format	PDF
ISSN	10709894
Volume Number	20
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-08-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Residual stresses Plastic integrated circuit packaging Moisture Lead Reflow soldering Silicon Temperature distribution Integrated circuit reliability Finite element methods Circuit testing
Content Type	Text
Resource Type	Article
Subject	Engineering

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