NDLI: Nonlinear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cycling

Content Provider	IEEE Xplore Digital Library
Author	Bor Zen Hong Bunell, L.G.
Copyright Year	1994
Abstract	A nonlinear finite element model has been used to simulate the thermally induced viscoplastic deformation of the controlled collapse chip connections (C4) solder joints in a high density single chip module (SCM). The dependence of solder joint deformation on the tin content was demonstrated for various lead-rich lead-tin alloys with the tin content varying from 2 wt.% to 10 wt.%. A thermoviscoplasticity theory was introduced for modeling the inelastic stress-strain response of the Pb-Sn alloys. In the theory, the creep and plasticity were separately considered and formulated. The Garofalo hyperbolic sine law was used to model the creep behavior, while the Prandtl-Reuss equation was used for the rate independent plastic deformation. The modeled SCM consists of a 5-mm silicon chip attached to a 50-mm alumina substrate by an array of C4 with diameter of 0.1 mm on a 0.2-mm I/O pitch. A cyclic temperature load of 0-100/spl deg/C at a frequency of 3 cycles per hour was applied to the SCM. It is concluded that the decrease of the tin content induces a decrease of the equivalent creep strain and Mises stress, but an increase of the equivalent plastic strain for the edge C4 in the SCM.<>
Sponsorship	Ericsson IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	585
Ending Page	591
Page Count	7
File Size	582356
File Format	PDF
ISSN	10709886
Volume Number	18
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Deformable models Creep Soldering Lead Plastics Capacitive sensors Tin alloys Equations Silicon
Content Type	Text
Resource Type	Article
Subject	Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in