NDLI: A shear-based optimization of adhesive thickness for die bonding

Content Provider	IEEE Xplore Digital Library
Author	Hokanson, K.E. Bar-Cohen, A.
Copyright Year	1994
Abstract	In low-cost integrated circuit (IC) packaging, a thin layer of adhesive is often used to bond the die to a leadframe or substrate. Because of the poor thermal conductivity of the adhesive, a thick layer will result in elevated chip temperatures. However, due to the differential expansion between the silicon and metal, a thin layer will result in high shear stress, in the adhesive, and along the bonded surfaces. In this study, first order thermal and thermostructural analytical relations for shear stress are used to determine the appropriate thickness of the adhesive layer between a die and a leadframe paddle, as encountered in PDIP packages. Numerical simulation, with finite element (FE) models, is used to examine the assumptions underpinning the analytical relations and to verify the analytical results. Using a filled-epoxy with an adhesion strength of 25 MPa, adhesive layer thicknesses between 0.027 and 0.2 mm are found to be suitable for this application. Assuming equal loss of reliability, due to chip temperature increases and shear stress increases, an optimum die-bond thickness of 0.16 mm is found. The FE computations appear to support the assumption that elevated shear stress is the most likely cause of die-bond structural failure for this subject package.<>
Sponsorship	Ericsson IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	578
Ending Page	584
Page Count	7
File Size	644243
File Format	PDF
ISSN	10709886
Volume Number	18
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Thermal stresses Bonding Thermal conductivity Temperature Integrated circuit packaging Silicon Numerical simulation Finite element methods Adhesives
Content Type	Text
Resource Type	Article
Subject	Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A shear based optimization of adhesive thickness for die bonding

A study on thermal stress of power IC die bonding

Thermal stress singularities in microelectronics

Manufacturing stresses in die due to die attach process

Thermal cycling reliability of die bonding adhesives

Optimization of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages for robust design

Modeling the die attach adhesives process

The impact of die attach material on type II popcorn cracking

'QL'-a new thermoplastic ribbon die attach adhesive

A shear-based optimization of adhesive thickness for die bonding

Similar Documents

A shear based optimization of adhesive thickness for die bonding

A study on thermal stress of power IC die bonding

Thermal stress singularities in microelectronics

Manufacturing stresses in die due to die attach process

Thermal cycling reliability of die bonding adhesives

Optimization of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages for robust design

Modeling the die attach adhesives process

The impact of die attach material on type II popcorn cracking

'QL'-a new thermoplastic ribbon die attach adhesive

A shear-based optimization of adhesive thickness for die bonding