NDLI: Technology application tradeoff studies in multichip systems

Content Provider	IEEE Xplore Digital Library
Author	Sandborn, P.A. Hashemi, H. Bal, L. Abadir, M.
Copyright Year	1994
Abstract	This paper presents the results of technology tradeoff studies for multichip systems. Performance analyses which are considered in this study focus on module costs, sizes, and routability, however thermal and electrical performance are also briefly considered. These metrics are influenced by different technology and design approaches including surface and through-hole mounting, wirebond, TAB, and flip chip attach, as well as printed circuit boards, ceramic, and thin film interconnects. Additional design details considered include passive component requirements, thermal structures, and connectors. A number of different modules are considered in the present study, including: a six-chip RISC processor module, a 24-chip RISC processor module with a cache memory, and a few-chip package consisting of a portion of a 80486-based PC motherboard with a cache controller. These examples demonstrate that appropriate technology selections are a function of the design constraints and the components which are packaged, and can not always be inferred from generalizations about the applicability of one technology over another.<>
Sponsorship	IEEE Computer Society
Starting Page	161
Ending Page	169
Page Count	9
File Size	1007344
File Format	PDF
ISSN	10709894
Volume Number	17
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Reduced instruction set computing Packaging Appropriate technology Performance analysis Costs Surface-mount technology Flip chip Printed circuits Ceramics Thin film circuits
Content Type	Text
Resource Type	Article
Subject	Engineering

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