NDLI: A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods

Content Provider	IEEE Xplore Digital Library
Author	Pendse, R.D.
Copyright Year	1978
Abstract	Integrated circuit device failures induced by package stress are classifiable into two broad categories: those involving device parametric shifts resulting from the piezoresistive properties of silicon; and those involving permanent damage to interconnect features such as metal, dielectric, and passivation layer. The relevance of one or both of these failure modes to different device types is considered. The design and use of suitable test chips to address such failure modes is discussed. The application of the finite element modeling (FEM) technique to analyze package stress is demonstrated. An approach involving the combination of FEM with empirical test chip data to considerably enhance the predictive capability of FEM is presented.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	870
Ending Page	873
Page Count	4
File Size	334249
File Format	PDF
ISSN	01486411
Volume Number	14
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Piezoresistance Electronic packaging thermal management Thermal stresses Temperature sensors Failure analysis Silicon Passivation Surface resistance Integrated circuit interconnections
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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