NDLI: Measurement and modeling of in situ lead stiffness of surface mounted packages

Content Provider	IEEE Xplore Digital Library
Author	Jahsman, W.E. Jain, P. Pope, D.E. Byrd, K.
Copyright Year	1978
Abstract	An approach to the experimental determination of in situ lead stiffness has been used to measure selected surface mount component (SMC) lead stiffness under simulated service conditions. Good agreement was obtained between the experimental data and three-dimensional elastic beam finite element analysis (FEA). The agreement was achieved through the use of a stiffness matching point, which provided insight into the level of constraint provided by the solder joint at the lead foot. When adequate solder was available, the solder served as a built-in boundary. When there was insufficient solder creep relaxation in the solder because of the high level of stress in the joint permitted rotation of the lead and the solder served as a pinned joint. Location of the stiffness matching point was found to be approximately 0.08 mm (0.003 in) below the solder fillet on the lead for the lateral stiffness component and about 0.15 mm (0.006 in) above the land for the transverse stiffness component.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	859
Ending Page	869
Page Count	11
File Size	964353
File Format	PDF
ISSN	01486411
Volume Number	14
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Soldering Electronics packaging Plastics Boundary conditions Testing Ceramics Packaging machines Finite element methods Stress
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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