NDLI: Temperature dependence of thermal expansion of ceramics and metals for electronic packages

Content Provider	IEEE Xplore Digital Library
Author	Chanchani, R. Hall, P.M.
Copyright Year	1978
Abstract	The X-Y (in-plane) expansivity was measured over the -40-140 degrees C range for several of the ceramics used in modern hybrids, single-chip packages, and multichip modules. These thermal expansion data were compared to those of silicon and the materials used for leads, lids, heat spreaders, and sinks. The expansivity of aluminas of different purities (92-99.5%), low-temperature cofired ceramics, aluminum nitride, and beryllia was measured. A k=4.8 sample was expansivity-matched to Si, and a k=8.0 sample matched to alumina. No significant effect of metallization of the multilayers on the expansivity was found. Aluminum nitride was found to be well matched to silicon, whereas beryllia was found to be well matched to alumina, Kovar, Invar, Alloy 42, molybdenum, and two composites, namely copper-molybdenum-copper and copper-Invar-copper, were measured. Kovar is well matched to alumina ceramic at room temperature; below and above room temperature, however, the expansivity of Kovar diverges from that of alumina.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	743
Ending Page	750
Page Count	8
File Size	818791
File Format	PDF
ISSN	01486411
Volume Number	13
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature dependence Thermal expansion Ceramics Silicon Aluminum nitride Packaging Multichip modules Heat sinks Metallization Nonhomogeneous media
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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