NDLI: A new face down bonding technique using a low melting point metal

Content Provider	IEEE Xplore Digital Library
Author	Mori, M. Saito, M. Hongu, A. Niitsuma, A. Ohdaira, H.
Copyright Year	1978
Abstract	A description is given of a face-down bonding technique, the low-melting-point metal connection (LMC) technique, for use in manufacturing liquid-crystal display (LCD) panels. By using a low melting point metal, such as an indium alloy, it is possible to connect the integrated circuit (IC) electrodes and bonding pads on a glass substrate at a temperature lower than 150 degrees C. First, using the dipping method, low-melting-point metal bumps were formed on the IC bonding pads with gold bumps. Shallow-bowl-shaped bumps, 10-20 mu m high, were the result. Next, the IC and the glass substrate were connected at a pressure of 30 gf/bump or less and a temperature of 150 degrees C or less. Two kinds of reliability tests were performed on this sample. One was a thermal shock test (TST): a repetition of -40 and 100 degrees C for 30 min each, for 300 cycles. The other was a high-temperature and high-humidity test: 70 degrees C, 90% relative humidity (RH) for 500 h. In both tests, stable results were obtained. Finally, dot matrix LCD panels, with 640*400 dots, were assembled with 20 driver IC chips. The panels displayed test patterns perfectly. The LMC technique makes it easy to test and repair the IC bonds. The results of the trial manufacturing and testing show that the LMC technique can be readily applied in manufacturing LCD panels and many other kinds of electronic equipment.<>
Sponsorship	IEEE Electronic Industries Alliance American Society of Mechanical Engineering (ASME) NBS SAE
Starting Page	444
Ending Page	447
Page Count	4
File Size	448788
File Format	PDF
ISSN	01486411
Volume Number	13
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Glass Temperature Electronic equipment manufacture Electronic equipment testing Manufacturing Liquid crystal displays Indium Electrodes Gold
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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