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High temperature pt/alumina co-fired system for 500 c electronic packaging applications
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Spry, David J. Chen, Liang-Yu Hunter, Gary W. Neudeck, Philip G. Beheim, Glenn M. |
| Copyright Year | 2015 |
| Description | Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors. |
| File Size | 1722861 |
| Page Count | 20 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20150023058 |
| Archival Resource Key | ark:/13960/t9x113r0g |
| Language | English |
| Publisher Date | 2015-09-15 |
| Access Restriction | Open |
| Subject Keyword | High Temperature Electronic Packaging Htcc Metal Films Prototypes Dynamic Stability Thick Films Metallizing Silicon Carbides Circuit Boards Chips Electronics High Temperature Environments Substrates Aluminum Oxides Ntrs Nasa Technical Reports ServerĀ (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Presentation |