NDLI: Packaging technologies for 500c sic electronics and sensors

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Packaging technologies for 500c sic electronics and sensors

Content Provider	NASA Technical Reports Server (NTRS)
Author	Chen, Liang-Yu
Copyright Year	2013
Description	Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.
File Size	2313176
Page Count	20
File Format	PDF
Alternate Webpage(s)	http://archive.org/details/NASA_NTRS_Archive_20130010538
Archival Resource Key	ark:/13960/t9673fp9c
Language	English
Publisher Date	2013-01-31
Access Restriction	Open
Subject Keyword	Electronics And Electrical Engineering Pressure Sensors Flight Tests Microelectromechanical Systems Ceramic Fibers Silicon Carbides Circuit Boards Wire High Temperature Environments Substrates Temperature Sensors Fabrication Electronic Packaging Chips Electronics Differential Pressure Aluminum Oxides Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science
Content Type	Text
Resource Type	Presentation

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