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Nasa-dod lead-free electronics project (Document No: 20130012620)
| Content Provider | NASA Technical Reports Server (NTRS) |
|---|---|
| Author | Kessel, Kurt |
| Copyright Year | 2009 |
| Description | In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder |
| File Size | 16441072 |
| Page Count | 34 |
| File Format | |
| Alternate Webpage(s) | http://archive.org/details/NASA_NTRS_Archive_20130012620 |
| Archival Resource Key | ark:/13960/t3kx0cv0z |
| Language | English |
| Publisher Date | 2009-11-01 |
| Access Restriction | Open |
| Subject Keyword | Metals And Metallic Materials Hazardous Materials Electronic Equipment Solders Elimination Shock Tests Environmental Tests Thermal Cycling Tests Electric Equipment Tests Electronic Equipment Tests Drop Tests Lead Metal Reliability Vibration Tests Toxic Hazards Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science |
| Content Type | Text |
| Resource Type | Presentation |
