NDLI: Nasa-dod lead-free electronics project (Document No: 20130012523)

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Nasa-dod lead-free electronics project (Document No: 20130012523)

Content Provider	NASA Technical Reports Server (NTRS)
Author	Kessel, Kurt R.
Copyright Year	2009
Description	In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.
File Size	22512732
Page Count	45
File Format	PDF
Alternate Webpage(s)	http://archive.org/details/NASA_NTRS_Archive_20130012523
Archival Resource Key	ark:/13960/t8hf2tf52
Language	English
Publisher Date	2009-09-21
Access Restriction	Open
Subject Keyword	Electronics And Electrical Engineering Tin Alloys Test Vehicles Solders Drop Tests Shock Tests Lead Alloys Environmental Tests Electronics Thermal Cycling Tests Vibration Tests Mechanical Engineering Ntrs Nasa Technical Reports Server (ntrs) Nasa Technical Reports Server Aerodynamics Aircraft Aerospace Engineering Aerospace Aeronautic Space Science
Content Type	Text
Resource Type	Article

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